Characterization of a copper matrix composite reinforced with nano/submicron-sized boron fabricated via spark plasma sintering

The addition of various reinforcing phases can improve the mechanical properties of copper. This study investigates the enhancement of the mechanical properties of copper by adding boron, focusing on overcoming the challenges associated with the homogeneous distribution of submicron/nanoscale secondary phases in metal matrix composites. Employing a combination of mechanical alloying and spark plasma sintering, a copper-boron composite containing 3 wt% boron was prepared. Scanning electron microscopy equipped with an electron backscatter diffraction detector and energy-dispersive X-ray spectroscopy was utilized to characterize the structure of the sintered samples and mechanically alloyed powder. A two-phase structure containing nano/submicron-sized boron distributed uniformly in the copper matrix was formed in the sintered sample. Instrumented micro-indentation tests were performed to characterize the mechanical behavior of the samples. The sintered composite sample exhibits significantly higher hardness than the sintered copper. The enhanced mechanical performance of the composite is primarily attributed to grain boundary strengthening and microstructural refinement, where nano/submicron-sized boron particles prevent grain growth and refine the microstructure, enhancing hardness and strength. Additionally, dispersion strengthening from hard boron particles and the presence of a high density of twin boundaries within the copper matrix increase resistance to dislocation motion and deformation, and further improving the material's mechanical properties. On the other hand, the composite sample exhibits increased electrical resistivity due to the boron's role as electron scattering centers. Overall, this study provides a valuable strategy for the design and optimization of advanced copper-based composites with tailored mechanical and electrical properties.